Author Search Result：Mitsumasa KOYANAGI(2hit)

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Vol.94 No.12 pp.1027-1032  
3D Interconnect Technology Using Through-Si Vias with Small Diameter
Mitsumasa KOYANAGI Tetsu TANAKA 
Summary | Full Text:PDF(1.5MB)

Vol.93 No.11 pp.918-922  
Super-chip Aiming Ultimate Heterogeneous Integration
Mitsumasa KOYANAGI Takafumi FUKUSHIMA Kangwook LEE Tetsu TANAKA 
Summary | Full Text:PDF(1.2MB)

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Online ISSN:2188-2355