Substrate Material and Packaging Technology for 5G Millimeter-wave Communication
Kaoru SUDO Hisao HAYAFUJI Takanori TOI
Vol.101 No.11 pp.1135-1139
Publication Date:2018/11/01
Online ISSN:2188-2355
Print ISSN:0913-5693
Type of Manuscript:Special Issue : 5G to Take off Soon ; What Will Change in the New Communication Society?
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