Implementing an Optical Interconnect Integrated Circuit on a Single Silicon Substrate with 3.5 Tbit/(s･cm<sup>2</sup>) Transmission Density : A Prospect for Further Scaling Down from a Printed Circuits Board into a Chip

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Implementing an Optical Interconnect Integrated Circuit on a Single Silicon Substrate with 3.5 Tbit/(s･cm²) Transmission Density : A Prospect for Further Scaling Down from a Printed Circuits Board into a Chip

Technical Topics Committee

Vol.95 No.2 pp.149-150

Publication Date:2012/02/01

Online ISSN:2188-2355

Print ISSN:0913-5693

Type of Manuscript:News Analysis

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