3D Interconnect Technology Using Through-Si Vias with Small Diameter
Mitsumasa KOYANAGI Tetsu TANAKA
Vol.94 No.12 pp.1027-1032
Publication Date:2011/12/01
Online ISSN:2188-2355
Print ISSN:0913-5693
Type of Manuscript:Special Section on Interconnection Technologies
Category:
Keyword:
---
Full Text:PDF(1.5MB)>>
Summary: