Summary

3D Interconnect Technology Using Through-Si Vias with Small Diameter

Mitsumasa KOYANAGI Tetsu TANAKA 

Vol.94 No.12 pp.1027-1032

Publication Date:2011/12/01

Online ISSN:2188-2355

Print ISSN:0913-5693

Type of Manuscript:Special Section on Interconnection Technologies

Category:

Keyword:
---

Full Text:PDF(1.5MB)>>

Buy this Article

Summary:

Login

 > 

Forgotten your password?

menu

Online ISSN:2188-2355